Electronic components e.g. ball grid array type encapsulation packages, connecting method, involves connecting conducting zones of external outputs of components appearing on wafer`s connection surface

摘要

The method involves transferring electronic components on the upper surface of a printed circuit (51). A resin layer (52) is deposited on the upper surface to ensure mechanical holding of the components. A wafer is surfaced in order to permit appearance of conducting zones of external outputs of the components on a connection surface (55) of the wafer, where the zones are connected. An independent claim is also included for an electronic device comprising a set of components.