发明名称 COMPOSITE MATERIAL FOR SEALING
摘要 PROBLEM TO BE SOLVED: To provide a composite material for sealing, which substantially contains no lead component so as to reduce the environmental load, and is excellent in required low expansion property, weatherability, flowability or the like. SOLUTION: The composite material for sealing is composed of a phosphate-based lead-free glass powder and a filler powder. The filler powder contains a KZr<SB>2</SB>(PO<SB>4</SB>)<SB>3</SB>filler powder and/or a K<SB>0.5</SB>Nb<SB>0.5</SB>Z<SB>1.5</SB>(PO<SB>4</SB>)<SB>3</SB>filler powder. Further, the phosphate-based lead-free glass powder is obtained by using glass containing, by mol, 30-70% SnO, 20-45% P<SB>2</SB>O<SB>5</SB>, 0-20% ZnO, 0-10% Al<SB>2</SB>O<SB>3</SB>, 0-15% SiO<SB>2</SB>, and 0-30% B<SB>2</SB>O<SB>3</SB>. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005162570(A) 申请公布日期 2005.06.23
申请号 JP20030406732 申请日期 2003.12.05
申请人 NIPPON ELECTRIC GLASS CO LTD 发明人 KIKUTANI TAKETAMI
分类号 C03C8/24;(IPC1-7):C03C8/24 主分类号 C03C8/24
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