PROCESS SOLUTION CONTAINING SURFACTANT FOR USE AS TREATMENT AGENT AFTER CHEMICAL MACHINERY PLANARIZATION

摘要

PROBLEM TO BE SOLVED: To provide a process solution for removing treatment residue from a semiconductor substrate followed by CMP treatment and a method using the process solution. SOLUTION: The number of defects in manufacture of a semiconductor device is reduced using a process solution containing one or a plurality of surfactants. In some desirable embodiments, the process solution of the invention can reduce defects during CMP treatment and when it is used as a rinse solution thereafter. Further, a method of reducing the number of certain defects on a substrate after a plurality of CMP treatments using the process solution of the invention is disclosed. COPYRIGHT: (C)2005,JPO&NCIPI