发明名称 |
Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus |
摘要 |
A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor element from a portion coupled to the electrodes; second wirings coupled between the first wirings and external terminals, the second wirings being directed to an outer area of the semiconductor element relative to the center; and at least one resin layer formed between the first wirings and the second wirings.
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申请公布号 |
US2005133914(A1) |
申请公布日期 |
2005.06.23 |
申请号 |
US20040016504 |
申请日期 |
2004.12.17 |
申请人 |
ITO HARUKI |
发明人 |
ITO HARUKI |
分类号 |
H01L23/12;H01L21/56;H01L23/28;H01L23/31;(IPC1-7):H01L21/44;H01L23/52 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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