| 摘要 |
The invention relates to a semiconductor component arrangement having the following features: a semiconductor body (HLK), with a front side (V) and a rear side (R), at least one first semiconductor switching element (M) and a defect identification circuit ( 110 ), which are integrated in the semiconductor body (HLK), the defect identification circuit ( 110 ) being arranged adjacent to the at least one semiconductor switching element (M), comprising a temperature sensor (DS) and also an evaluation circuit (AWS) and being designed to make a defect signal (DS) available in the event of a temperature indicating a defect in the at least one semiconductor switching element (M), the evaluation circuit (AWS) for providing the defect signal (DS) having a second semiconductor switching element (HLS) and a drive circuit (DRV) for the second semiconductor switching element (HLS).
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