Semiconductor device socket

摘要

A guide member is supported to be movable relative to an accommodation portion of a contact-moving member An engagement pin is engaged with a post portion so that the maximum displacement of the guide member is limited within the maximum displacement of a semiconductor element. The inner circumference of the accommodation portion of the contact-moving member is brought into contact with the outer circumference of the guide member so that the maximum displacement A of the contact-moving member is limited. Thus, a gap CL (=A-B) is defined between the inner circumference of the contact-moving member and an end surface of the guide member opposed thereto.