Chip orientation and attachment method

摘要

A chip orientation and attachment method is disclosed which eliminates or substantially reduces chip damage caused by thermal stress induced by application of a molding compound to the chip and substrate. The chip is attached to the substrate in such a manner that at least one of the following conditions exists: the chip diagonal and the substrate diagonal are in non-aligned relationship, and/or the chip edges are non-parallel with respect to the substrate edges, and/or the chip center is in non-overlapping relationship with respect to the substrate center. The invention includes chip package structures fabricated according to the chip orientation and attachment method.