| 发明名称 |
METHOD FOR PRODUCING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE PRODUCED THEREBY |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing an epoxy resin composition for semiconductor encapsulation free from the formation of void, etc., and having high reliability. SOLUTION: The epoxy resin composition for semiconductor encapsulation containing (A) an epoxy resin, (B) a phenolic resin and (C) a cure accelerator is produced by preparatorily mixing a part or all of the compounding components except for the component (A) under a reduced pressure of 1.333-66.65 kPa at 100-230°C and adding and mixing the component (A) and the remaining components to the preparatorily mixed product. COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2005162942(A) |
申请公布日期 |
2005.06.23 |
| 申请号 |
JP20030406213 |
申请日期 |
2003.12.04 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
TOYODA HIDESHI;OKADA TAKESHI;YOSHIKAWA KEISUKE;ETO TAKUYA;IKEMURA KAZUHIRO;AKIZUKI SHINYA;ISHIZAKA TAKESHI;UCHIDA TAKAHIRO;TOYODA KEI |
| 分类号 |
C08G59/00;C08G59/18;C08G59/62;C08G59/68;C08L61/04;C08L61/06;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08G59/62 |
主分类号 |
C08G59/00 |
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