发明名称 MULTILAYER CHIP FILTER
摘要 PROBLEM TO BE SOLVED: To provide a T-connected multilayer chip filter in which two coils and one capacitor of T connection mainly used for EMI elimination are integrated into one chip and which is suitable for matching a transmission line. SOLUTION: A multilayer chip filter 20 includes: a capacitor part formed in a dielectric multilayer body 17 by stacking dielectric sheets and forming an opposed electrode pattern composed of electrode plates formed on the surface of the dielectric sheets and through-holes; and two coils which are formed in magnetic multilayer bodies 18, 19 and of which the permeabilities differ from each other and which are integrally formed on both sides of the multilayer capacitor by stacking two kinds of magnetic sheets made of magnetic materials, respectively, having permeabilities different from each other while interposing the dielectric multilayer body 17 and forming conductor lines formed on the surfaces of the magnetic sheets and conductor patterns by through-holes. One-side terminals of the coils are conductively connected, other terminals of the two coils are connected to input/output external electrodes 15, 15, respectively, at each end face of the two magnetic multilayer bodies 18, 19, and a ground side terminal of the capacitor is connected to a grounding external electrode 16 to configure the T type filter. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005167483(A) 申请公布日期 2005.06.23
申请号 JP20030401684 申请日期 2003.12.01
申请人 TAIYO YUDEN CO LTD 发明人 IWAO HIDEMI
分类号 H01F27/00;H03H7/075;(IPC1-7):H03H7/075 主分类号 H01F27/00
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