| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which suppresses the forming of air bubbles, and has high reliability against the etching of conductive pattern simultaneously. SOLUTION: The semiconductor device comprises: a semiconductor chip 6 having a pad 7; an insulating substrate 1 bonded to the semiconductor chip 6; a conductive pattern 2 which has a bonding portion 2WB, which is formed on the insulating substrate 1, connected to a pad of the semiconductor chip 6, a pad portion 2BP connected to an external electrode 11, and an interconnect line portion 2WR connecting the bonding portion 2WB with the pad portion 2BP respectively; and a coating layer 3 which coats the conductive pattern 2 formed on the insulating substrate 1 on a region except for at least the bonding portion 2WB and the pad portion 2BP. A crossed axes angleθbetween the edge of the coating layer 3 and the bonding portion 2WB exceeds 90°. COPYRIGHT: (C)2005,JPO&NCIPI
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