APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce a stage setting temperature by efficiently conducting stage heat to a semiconductor chip. SOLUTION: In the method of manufacturing the semiconductor device comprising an alignment step of aligning an inner lead and a bump on the semiconductor chip and an inner lead bonding step of performing inner lead bonding while keeping the aligned state, the inner lead bonding step uses a metallic trapezoidal stage which includes a bonding tool and a heating means and has high heat conductivity. COPYRIGHT: (C)2005,JPO&NCIPI