PRINTED WIRING BOARD FOR ELECTRONIC COMPONENT MOUNTING, MANUFACTURING METHOD FOR PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board for electronic component mounting, a manufacturing method for the printed wiring board, and a semiconductor device which prevent a plating solution such as a tin plating solution from coming into a gap between a field-via and an insulating film in manufacturing the printed wiring board which enables a wiring pattern to be formed on one surface of an insulating film and a semiconductor chip and a passive component to be also mounted on the surface opposite to the surface with the wiring pattern via the field-via. SOLUTION: One exposed end of the field-via 4 is connected to the wiring pattern, and a plating resist is formed at least at the boundary between the field-via 4 and the insulating film 2 at the the other exposed end. Terminal plating 5 is applied to the end of the field-via 4 that is surrounded with the plating resist 7 and is exposed inward, and then the the plating resist 7 is removed. COPYRIGHT: (C)2005,JPO&NCIPI