DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device and a semiconductor manufacturing method by which a semiconductor can be trimmed and inspected by a simple equipment. SOLUTION: The semiconductor manufacturing device is provided with a prober 40 wherein a probe can be simultaneously brought into contact with pads in two chip formation areas within a wafer 1. The prober 40 trims one chip formation area and inspects the other chip formation area after trimming. COPYRIGHT: (C)2005,JPO&NCIPI