发明名称 METHOD FOR MANUFACTURING THERMOELEMENT MODULE
摘要 PROBLEM TO BE SOLVED: To efficiently improve wettability between a material of an electrode 2 and a bonding member in a method for manufacturing a thermoelement module 10 comprising a process wherein a large thermoelement plate 6 is divided into individual thermoelements 3, and the electrode 2 containing Cu and arranged on a substrate 1 and an individual thermoelement 3 are bonded to each other by the bonding member. SOLUTION: Cu-plated layer 5 are formed on both surfaces of a large thermoelement plate 6, and then the thermoelement plate 6 is divided into individual thermoelements 3. The Cu-plated layer 5 of each individual thermoelement 3 is bonded to an electrode 2 and/or to a bonding member that does not substantially contain Sn. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005166857(A) 申请公布日期 2005.06.23
申请号 JP20030402434 申请日期 2003.12.02
申请人 MINOWA KOA INC 发明人 TAKAYAMA TOSHIJI
分类号 H01L35/08;H01L35/18;H01L35/34;H02N11/00;(IPC1-7):H01L35/08 主分类号 H01L35/08
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