发明名称 MANUFACTURING METHOD OF TAPE FOR TAB
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a tape for TAB for reducing warpage thereof. SOLUTION: The method of manufacturing the tape for TAB including at least an insulating layer and a conductive layer comprises steps of forming the insulating layer, and bonding the insulating layer and a conductive layer. The linear expansion coefficient C<SB>TE</SB>of the insulating layer and a humidity absorbing expansion coefficient C<SB>HE</SB>satisfy the relationship of C<SB>TE</SB>×2-C<SB>HE</SB>-32≥0. Here, the elasticity of the insulating layer can be set to 4.5 GPa or higher. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005166818(A) 申请公布日期 2005.06.23
申请号 JP20030401825 申请日期 2003.12.01
申请人 KANEKA CORP 发明人 KANESHIRO NAGAYASU
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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