| 摘要 |
PROBLEM TO BE SOLVED: To provide a dipping exposure device that can expose the peripheral section of a wafer to light and can suppress the occurrence of water marks caused by the evaporation of a dipping agent. SOLUTION: The dipping exposure device is provided with a cover which covers the whole moving area of the wafer at the time of exposing the wafer to light so that the dipping agent may always cover the whole surface of the wafer. COPYRIGHT: (C)2005,JPO&NCIPI
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