| 发明名称 |
Methods and apparatus for laser dicing |
| 摘要 |
An apparatus and method of dicing a microelectronic device wafer by laser ablating at least an interconnect layer portion of the microelectronic device wafer in the presence of an anion plasma, wherein the anion plasma reacts with debris from the laser ablation to form a reaction gas.
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| 申请公布号 |
US2005136622(A1) |
申请公布日期 |
2005.06.23 |
| 申请号 |
US20030742186 |
申请日期 |
2003.12.18 |
| 申请人 |
MULLIGAN ROSE A.;SHARAN SUJIT |
发明人 |
MULLIGAN ROSE A.;SHARAN SUJIT |
| 分类号 |
B23K26/12;B23K26/16;B23K26/40;H01L21/78;(IPC1-7):B23K26/14;H01L21/301;H01L21/46 |
主分类号 |
B23K26/12 |
| 代理机构 |
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