| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit with its conductor formed as a micro interconnection pattern by an active method and with a damage and cutting-off of the conductor decreased at a flying lead part. <P>SOLUTION: The suspension substrate with the circuit comprises a supporting substrate 2, a base insulating layer 3 formed on the substrate 2, a conductive layer 4 formed on the layer 3, a cover insulating layer 5 formed on the layer 4, and the flying lead part 9 with the suspension substrate side opening part 13, a base side opening part 14, and the cover side opening part 15 opened so that the both sides of the layer 4 are exposed at an external side connecting terminal 7. A reinforcing part 16 or 23 for reinforcing the layer 4 consecutively formed along a longitudinal direction of the layer 4 from at least either of the layer 3 or the layer 5 is included at the part 9. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
