| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet which can easily peel off a protective film without weakening adhesive strength of the pressure-sensitive adhesive and can adequately glue a dicing ring to a dicing-ring mounting part and provide an easy dicing process. SOLUTION: An adhesive 2 of a prescribed planar shape, a pressure-sensitive adhesive 3 that covers the adhesive 2, has a size somewhat larger than that of the adhesive 2, and has a peripheral edge part that does not overlap the adhesive 2, and a base film 4 that overlaps the pressure-sensitive adhesive 3, are laminated in this order on a surface of a protective film 1, or a pressure-sensitive adhesive 5 of a prescribed planar shape and the base film 4 that overlaps the pressure-sensitive adhesive 5 are laminated in this order on the surface of the protective film, to form the pressure-sensitive adhesive sheet for manufacturing semiconductor devices, wherein a tape-shaped small piece 6 is placed in a part of the peripheral edge part to form a starting point for the peeling that enables easily to peel and remove the protective film 1. COPYRIGHT: (C)2005,JPO&NCIPI |
