发明名称 SUBSTRATE EDGE AREA CLEANER
摘要 PROBLEM TO BE SOLVED: To make it possible to form a cleaning boundary with improved linearity in an arbitrary position by removing an unnecessary film material from the edge area of a square substrate without fail and to effectively prevent the formation of a swell due to solvent permeation by shortening a cleaning time. SOLUTION: A solvent S is fed onto the proximity of the edge area of the surface Ma of a substrate M to be treated through the outside surface 5b of a guide plate 5 fitted with lower edges 5a formed at acute angles and opposed to each other to leave a specified gap therebetween. Meanwhile, a gas W is released toward the edge surface Ma of the substrate M from the lower part and the sides of the substrate M, and the film material R dissolved in the solvent S is sucked up by means of suction nozzles 4. The dissolved film material R together with the solvent is completely removed from the proximity of the edge area of the substrate M. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005161155(A) 申请公布日期 2005.06.23
申请号 JP20030401574 申请日期 2003.12.01
申请人 TATSUMO KK 发明人 KAWADA ATSUSHI;SAINO KOSAKU
分类号 B08B5/04;B08B3/08;(IPC1-7):B08B3/08 主分类号 B08B5/04
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