METHOD FOR INSPECTION OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for the inspection of a semiconductor device capable of reliably carrying out the batch inspection of electrical characteristics of a plurality of semiconductor devices formed on a semiconductor wafer. SOLUTION: When forming insulating coatings on inspection electrodes 15 of a defective semiconductor device among the plurality of semiconductor devices formed on the semiconductor wafer 11, and performing batch inspection by applying voltages or signals to the inspection electrodes of the remaining semiconductor devices; a process of forming the insulating coatings on the inspection electrodes 15 of the defective semiconductor device forms recesses 15a on the upper surfaces of the electrodes 15 by using a recessing tool 21, and forms the insulating coating at the recess 15a. The insulating coating is applied by an insulating resin application nozzle 25. COPYRIGHT: (C)2005,JPO&NCIPI