发明名称 MOUNT, PACKAGE, AND PACKAGING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a mount, a package, and a packaging method, which keep a manufacturing cost low to lower the price of the package as a product. SOLUTION: The package comprises the mount 2, which is used to fold a flexible article 13 into an almost rectangular parallelepiped and keep the article 13 folded, and a packaging bag 10, which houses the mount 2 and the article 13 together. The mount 2 has a top board 3, which comes in contact with the top face 14 of the article 13, a pair of side boards 4, 4, which come in contact with counter two side faces 15, 15 of the article 13, a pair of bottom boards 5, 5, which come in contact with the bottom face 16 of the article 13, and a pair of insertion boards 6, 6, which are inserted into an overlapping part 17 of the article 13. The package is placed in a showcase or the like with the bottom boards 5, 5 set at the lower side, so that the insertion boards 6, 6 are prevented from slipping out of the article 13 and the mount 2 keeps on enclosing the article 13. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005162281(A) 申请公布日期 2005.06.23
申请号 JP20030404902 申请日期 2003.12.03
申请人 S T CHEM CO LTD 发明人 SHIMIZU TOMOMITSU;TAKAHASHI MASATOSHI
分类号 B65B11/48;B65D33/14;B65D75/20;B65D77/26;B65D85/18;(IPC1-7):B65D77/26 主分类号 B65B11/48
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