发明名称 |
Method for manufacturing Semiconductor device, adhesive sheet for use therein and semiconductor device |
摘要 |
A series of semiconductor devices includes: (i) a plurality of semiconductor elements having electrodes; (ii) a plurality of electrically conductive parts formed around and electrically connected to each of the semiconductor elements; and (iii) a sealing resin in which the plurality of semiconductor elements and the plurality of electrically conductive parts are sealed and an electrode-free side of each semiconductor element and an unwired side of each electrically conductive part are formed on a single flat surface of a removable substrate.
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申请公布号 |
US2005133824(A1) |
申请公布日期 |
2005.06.23 |
申请号 |
US20050032290 |
申请日期 |
2005.01.10 |
申请人 |
HOSOKAWA KAZUHITO;OKEYUI TAKUJI;FUJII HIROFUMI;YAMAMOTO YASHUHIKO |
发明人 |
HOSOKAWA KAZUHITO;OKEYUI TAKUJI;FUJII HIROFUMI;YAMAMOTO YASHUHIKO |
分类号 |
H01L23/12;H01L21/48;H01L21/56;H01L21/68;H01L23/31;(IPC1-7):H01L29/739;H01L31/032;H01L31/033;H01L31/072;H01L31/109 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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