| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card capable of performing highly accurately an electrical test of a circuit pattern even when a wafer is large, and reducing cost, and its manufacturing method. SOLUTION: This probe card 1 for testing electrically the circuit pattern 12 on the wafer 11 has a ceramic substrate 14 having a circuit pattern 13 for the test, and a metal bump 15 formed on the surface of the ceramic substrate 14, connected to the circuit pattern 13 on the ceramic substrate 14, and having conductivity enabling contact with the the circuit pattern 12 on the wafer 11. COPYRIGHT: (C)2005,JPO&NCIPI
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