摘要 |
PROBLEM TO BE SOLVED: To provide a mold capable of perfectly performing resin sealing at once by an injection mold. SOLUTION: The mold is constituted of an upper mold 1, a lower mold 2, a lower mold receiving plate 3 and a cylinder 4. At least one first locating pin 11 is provided to the upper mold 1 and at least one second locating pin 31 is provided to the lower mold 2. At the time of resin sealing molding, an object A to be sealed is fixed in the mold by the first locating pin 11, the second locating pin 21 and the cylinder, and these pins and the cylinder are allowed to retreat in a resin injection process to uniformly seal the object A to be sealed with a resin at once. COPYRIGHT: (C)2005,JPO&NCIPI
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