发明名称 MOLD CAPABLE OF PERFECTLY PERFORMING RESIN SEALING AT ONCE
摘要 PROBLEM TO BE SOLVED: To provide a mold capable of perfectly performing resin sealing at once by an injection mold. SOLUTION: The mold is constituted of an upper mold 1, a lower mold 2, a lower mold receiving plate 3 and a cylinder 4. At least one first locating pin 11 is provided to the upper mold 1 and at least one second locating pin 31 is provided to the lower mold 2. At the time of resin sealing molding, an object A to be sealed is fixed in the mold by the first locating pin 11, the second locating pin 21 and the cylinder, and these pins and the cylinder are allowed to retreat in a resin injection process to uniformly seal the object A to be sealed with a resin at once. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005161678(A) 申请公布日期 2005.06.23
申请号 JP20030403659 申请日期 2003.12.02
申请人 GENI KAGI KOFUN YUGENKOSHI 发明人 KAKU SHISHO
分类号 B29C45/26;B29C45/14;(IPC1-7):B29C45/26 主分类号 B29C45/26
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