| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method which allows easy and accurate manufacture, and miniaturization, by having a structure to move a pair of part in parallel with each other. SOLUTION: A rectangular plate 510 is connected to a plate 500 on a base board 1 via a hinge 310. A rectangular plate 520 is connected to the plate 510 via a hinge 320. A rectangular plate 530 is connected to the plate 520 via a hinge 330. A rectangular electrostatic plate 222 is arranged on the plate 500, and a rectangular electrostatic plate 122 is arranged on the plate 530. The hinges 310, 320 and 330 are bent in a tough shape. When impressing voltage between the electrostatic plate 122 and the electrostatic plate 222, electrostatic force acts between the electrostatic plate 122 and the electrostatic plate 222, and the plate 530 moves in parallel to the plate 500. COPYRIGHT: (C)2005,JPO&NCIPI
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