| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating method by which the treating time of a substrate to be treated can be shortened, treating performance can be improved, and the exposing time of the substrate to the atmospheric air can be minimized. SOLUTION: The substrate treating method includes: a process (1) of storing a first treating liquid in a substrate treating vessel; a process (2) of treating the substrate to be treated by dipping the substrate in the liquid; and a process (3) of discharging the liquid from the vessel in a short time. The method also includes: a process (4) of cleaning the substrate by radially spraying a rinsing solution from the upside of the vessel and, almost simultaneously, supplying the solution from the bottom section of the vessel; a process (5) of discharging the solution from the vessel in a short time; and a process (6) of treating the substrate by radially spraying a second treating liquid from the upside of the vessel and, almost simultaneously, supplying the liquid from the bottom section of the vessel. In addition, the method also includes: a process (7) of discharging the liquid from the vessel in a short time; a process (8) of cleaning the substrate by radially spraying the rinsing solution from the upside of the vessel and, almost simultaneously, supplying the solution from the bottom section of the vessel; and a process (9) of discharging the solution from the vessel in a short time. Moreover, the method includes a process (10) of drying the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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