| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure of an integrated circuit maximizing a consideration of a heat transmission of an integrated circuit capable of effectively transmitting the heat from the integrated circuit to a heat radiating member. SOLUTION: The cooling structure comprises a heat transmitting channel member 30 which contacts the opposite side of a packaging surface of the integrated circuit 20 packaged to a substrate 10 and is a transmission channel of the heat generated from the integrated circuit 20, a grasping device 40 engaged with the member 30 and hooked to the packaging surface of the circuit 20 by grasping the both end faces of the circuit 20, and a heat sink 50 fixed to the member 30. COPYRIGHT: (C)2005,JPO&NCIPI
|
