Härtbare Siliconzusammensetzung und elektronische Bauteile

摘要

A curable silicon composition, comprising (A) 100 parts by weight of an organopolysiloxane containing silicon-bonded aryl groups and at least two alkenyl groups per molecule, and having a viscosity of from 0.01 to 1,000 Pa.s at 25 DEG C, wherein the aryl groups comprise from 1 to 40 mole% of the total silicon-bonded organic groups in the organopolysiloxane; (B) an organopolysiloxane having a viscosity of from 0.001 to 10 Pa.s at 25 DEG C and containing at least 2 silicon-bonded hydrogen atoms per molecule, in a quantity sufficient to cure the composition; (C) a platinum catalyst in a quantity sufficient to cure the composition; and (D) 0.00001 to 100 parts by weight of an organopolysiloxane having a viscosity of from 0.01 to 10,000 Pa.s at 25 DEG C, with the proviso that when the organopolysiloxane contains aryl groups, the aryl groups comprise less than 1 mole% or more than 40 mole% of the total silicon-bonded organic groups in the organopolysiloxane, and wherein the orgiopolysiloxane cures to form a silicone having a complex modulus ≤ 1 x 10<8> Pa at -65 DEG C and a shear frequency of 10 Hz or a cured silicone having a Young's modulus ≤ 2.9 x 10<8> Pa at -65 DEG C.