发明名称 |
Bondkopf für dicken Draht |
摘要 |
A bonding head is connected for z-axis movement over an electrical or electronic component to which a wire is to be bonded. An ultrasonic transducer has bonding tool for bonding the wire. A flexible support formed from arcuate arm supports bonding tool (278) for flexible movement of the bonding tool along the z-axis direction. An Independent claim is included for ultrasonic wire bonding method. |
申请公布号 |
DE10207498(B4) |
申请公布日期 |
2005.06.23 |
申请号 |
DE2002107498 |
申请日期 |
2002.02.22 |
申请人 |
ORTHODYNE ELECTRONICS CORP., IRVINE |
发明人 |
RINGLER, ANDREAS H. |
分类号 |
B23K20/00;B23K20/10;H01R43/02;(IPC1-7):B23K37/00 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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