发明名称 Bondkopf für dicken Draht
摘要 A bonding head is connected for z-axis movement over an electrical or electronic component to which a wire is to be bonded. An ultrasonic transducer has bonding tool for bonding the wire. A flexible support formed from arcuate arm supports bonding tool (278) for flexible movement of the bonding tool along the z-axis direction. An Independent claim is included for ultrasonic wire bonding method.
申请公布号 DE10207498(B4) 申请公布日期 2005.06.23
申请号 DE2002107498 申请日期 2002.02.22
申请人 ORTHODYNE ELECTRONICS CORP., IRVINE 发明人 RINGLER, ANDREAS H.
分类号 B23K20/00;B23K20/10;H01R43/02;(IPC1-7):B23K37/00 主分类号 B23K20/00
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