| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package board for an IC chip that prevents malfunctions or errors from occurring even if the frequency for the IC chip to be mounted exceeds a high frequency, 3GHz in particular. <P>SOLUTION: A plane layer 158P for power source is thickened to reduce the amount of resistance, thus making it possible to improve power supplying capacity. Therefore, the shortage of power supply at an initial operation is reduced, thereby preventing malfunctions or errors from occurring even if an IC chip for a higher frequency region is mounted. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
