发明名称 CIRCUIT CONNECTING MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER USING IT
摘要 PROBLEM TO BE SOLVED: To provide a circuit connecting material or the like by which better electrical connection between circuit electrodes confronted each other is attained and long-term reliability of electrical characteristics between the circuit electrodes is sufficiently improved, regardless of existence or non-existence of irregularities on the surface of the circuit electrodes. SOLUTION: The circuit connecting material 50 includes an adhesive composition 51 and conductive particles 12 having projected portions on a surface side, and a storage elastic modulus at 40°C becomes 0.5 to 3GPa by hardening treatment, while an average coefficient of thermal expansion from 25 to 100°C becomes 30 to 200 ppm/°C by hardening treatment. Even if the adhesive composition enters between the conductive particles 12 and the circuit electrodes when pressurized, a pressure applied to the adhesive composition by the projected portions 14 becomes fully higher than a pressure applied by the conductive particles with no projected portion, by which the projected portions 14 penetrate the adhesive composition with ease and are brought into contact with the circuit electrodes, and a state in which the conductive particles 12 are kept to be connected to the circuit electrodes is held for a longer term. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005166438(A) 申请公布日期 2005.06.23
申请号 JP20030403482 申请日期 2003.12.02
申请人 HITACHI CHEM CO LTD 发明人 ARIFUKU MASAHIRO;WATANABE ITSUO;GOTO YASUSHI;KOBAYASHI KOJI;NAKAZAWA TAKASHI
分类号 C09J7/00;C09J4/00;C09J9/02;C09J11/00;C09J163/00;C09J171/10;H01B1/22;H01B5/16;H01L21/60;H01R11/01;H05K1/14;(IPC1-7):H01R11/01 主分类号 C09J7/00
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