TRAY FOR VAPOR PHASE PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a tray for a vapor phase process where electrostatic chuck is possible and plasma-proof property etc. are excellent. SOLUTION: The tray for the vapor phase process for electrostatic chuck is stuck to a semiconductor board with an inorganic consecutive stomatal sintered body whose thickness is 0.05 to 1 mm and whose open porosity is 5 to 50% as a protection board. It is possible to provide the tray for a vapor phase process where a conventional electrostatic chuck function can be used without improving substantially and which uses chlorine-proof plasma etc. COPYRIGHT: (C)2005,JPO&NCIPI