| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation having excellent moldability and curability. SOLUTION: The epoxy resin composition for semiconductor encapsulation contains (A) an epoxy resin, (B) a phenolic resin, (C) a tetra-substituted phosphonium-phenolic resin salt compound expressed by general formula (1) (R<SB>1</SB>to R<SB>4</SB>are each independently an alkyl or an aryl; and X is an organic group formed by releasing one proton from a phenolic resin compound having≥2 phenolic hydroxyl groups) and having a softening point of 100-200°C and (D) an inorganic filler. COPYRIGHT: (C)2005,JPO&NCIPI |
