| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that prevents soils from sticking to a surface to be cut as much as possible in a cutting process of a semiconductor device that comprises supporting substrates bonded together, and to provide a dicing apparatus for implementing the manufacturing method. SOLUTION: The method of manufacturing a semiconductor device using a dicing apparatus 100 according to the present invention has following cutting steps. First, a control means 50 starts cutting operated by a dicing apparatus 100, starts supplying cooled water and washing water from a water supplying means 60 (step 80), and continues the water supplying (step 81). Here, when abnormal conditions are found by a monitoring means 70, the control means 50 stops cutting and temporarily stops supplying the cooled water and washing water (step 82). Then, after a predetermined time has passed, the control means 50 resumes supplying at least washing water of the cooled water and washing water (step 83). COPYRIGHT: (C)2005,JPO&NCIPI |
