| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal laminate which is comprised of metal foil and an adhesive, including both two functions of a function as die bonding and a function as a lead frame fixing adhesive substrate, in a semiconductor package comprised of a semiconductor device and a lead frame. SOLUTION: In the metal laminate comprised of the metal foil and the adhesive used in the semiconductor package comprised of the semiconductor device and the lead frame, a glass transition temperature before thermocuring of the adhesive is≥30°C and≤100°C, and an elastic modulus in the temperature range of 250°C to 300°C after thermocuring of the adhesive is≥1MPa and≤100MPa. COPYRIGHT: (C)2005,JPO&NCIPI |
