| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing metallic wires or metallic electrodes in which the generation of sidewall attachments (burrs) to be generated by a lift-off method adopting dipping in a peeling solution is suppressed in the case of forming the metallic wires or the metallic electrodes in a semiconductor device. SOLUTION: Metallic films are deposited on the pattern of a photoresist 103, the photoresist 103 and the metallic films 104, 105 are instantaneously cooled by blowing out carbon dioxide gas particulates 107. Because of sharp differences in the thermal expansion coefficients of the photoresist 103 and the metallic films 104, 105, the metallic films 105, which may cause the generation of burrs, stuck to the sidewalls of the photoresist 103 can be easily cut off from the metallic films 104, and metallic electrodes or metallic wires free from burrs can be obtained. COPYRIGHT: (C)2005,JPO&NCIPI
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