发明名称 SEALING RESIN COMPOSITION AND RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a sealing resin composition which has excellent flame retardancy without substantially using a halogen-based flame retardant and an antimony compound, and has a low contracting property and a low moisture-absorbing property. SOLUTION: The sealing resin composition containing (a) an epoxy resin, (b) a phenolic resin curing agent, (c) a curing accelerator, (d) an inorganic filler, and (e) a coupling agent as essential components is characterized in that (a) the epoxy resin contains an epoxy resin represented by the formula (1) [(n) is an integer of≥1] and an epoxy resin represented by formula (2) [(m) and (n) are each an integer of≥1; R is an alkyl] and having a number-average mol. wt. of≥1,500 as essential components and that (b) the phenolic resin curing agent contains a phenolic resin curing agent represented by formula (3) [(n) is an integer of≥1] as an essential component. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005162826(A) 申请公布日期 2005.06.23
申请号 JP20030401755 申请日期 2003.12.01
申请人 KYOCERA CHEMICAL CORP 发明人 WADA YUZURU
分类号 C08L63/00;C08G59/20;C08G59/62;H01L23/29;H01L23/31;(IPC1-7):C08G59/20 主分类号 C08L63/00
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