摘要 |
A semiconductor integrated circuit includes a plurality of first wires running in a first direction of 0°, a 45° diagonal, a 90° angle and a 135° diagonal in a subject area disposed in a designated wiring layer in a multilevel interconnection; and a plurality of second wires running in a second direction of 0°, the 45° diagonal, the 90° angle and the 135° diagonal in a wiring region other than the designated region in the designated wiring layer.
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