| 发明名称 |
MESOPOROUS SILICA/FLUORIDATED POLYMER COMPOSITE MATERIAL |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mesoporous silica/fluoridated polymer composite material containing a modified hydrophobic mesoporous silica. <P>SOLUTION: The composite material contains a hydrophobic hollow silica with a hollow diameter of 0.1-50 nm and a fluoridated polymer and has a permittivity smaller than 4, a dielectric dissipation factor smaller than 0.04 and thermal expansion coefficient of≤60 ppm/°C. The material is suitable to be used for a printed circuit board, especially for a high-frequency wave substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
| 申请公布号 |
JP2005163006(A) |
申请公布日期 |
2005.06.23 |
| 申请号 |
JP20040107988 |
申请日期 |
2004.03.31 |
| 申请人 |
CHUNG YUAN CHRISTIAN UNIV |
发明人 |
CHEN YUI WHEI;CHEN CHIH WEI;WU YAO ZU |
| 分类号 |
C08L27/12;B32B3/26;C01B33/36;C08K3/36;C08K9/00;C09C1/30;H05K1/02;H05K1/03;(IPC1-7):C08L27/12 |
主分类号 |
C08L27/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
