| 摘要 |
PROBLEM TO BE SOLVED: To transfer a metallic mold pattern to an accurate position on a substrate. SOLUTION: The equipment has a holding block 41 holding a metallic mold for forming a pattern with a specific shape onto a substrate 200, a wafer stage 21 that holds the substrate 200, a press mechanism 50 that presses a metallic mold 100 to the substrate 200 held by the wafer stage 21, a transfer mechanism 30 that relatively transfers the wafer stage 21 and the holding block 41, a CCD camera 84 for detecting positional information that shows the relative positions of the pattern and the metallic mold 100 on the substrate 200 held by the wafer stage 21, a storage means previously storing position information showing the information about the position of the metallic mold 100, and a control means for controlling the transfer mechanism 30 based on the position information detected by the CCD camera 84 and position information stored in the storage means beforehand, thus precisely controlling the positions to transfer the pattern of the metallic mold 100 onto the substrate 200. COPYRIGHT: (C)2005,JPO&NCIPI
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