| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate processing equipment capable of performing a specified cleaning processing while sustaining the cleaning effect without causing any damage on a fine pattern. SOLUTION: The substrate processing equipment is arranged such that processing liquid and gas are introduced to a two fluid nozzle 2, the processing liquid is discharged from the liquid outlet 39a of the two fluid nozzle 2, gas is sprayed to the processing liquid to create processing liquid drops, and the liquid drops are supplied toward the surface of a substrate W. The height H from the substrate W to the nozzle 2 is adjusted such that the cleaning width D of the liquid drops being supplied from the two fluid nozzle 2 falls within a range of 5.0-15.0 mm. According to the arrangement, damage onto a fine pattern formed on the substrate W can be prevented while sustaining the removal rate at substantially the same level as that of the prior art. COPYRIGHT: (C)2005,JPO&NCIPI
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