发明名称 |
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities |
摘要 |
A packaging substrate ( 310 ) includes a semiconductor interposer ( 120 ) and at least one other intermediate substrate ( 110 ), e.g. a BT substrate. The semiconductor interposer has first contact pads ( 136 C) attachable to dies ( 124 ) above the interposer, and second contact pads ( 340 ) attachable to circuitry below the interposer. Through vias ( 330 ) are made in the semiconductor substrate ( 140 ) of the interposer ( 120 ). Conductive paths going through the through vias connect the first contact pads ( 136 C) to the second contact pads ( 340 ). The second contact pads ( 340 ) protrude on the bottom surface of the interposer. These protruding contact pads ( 340 ) are inserted into vias ( 920 ) formed in the top surface of the BT substrate. The vias provide a strong mechanical connection and facilitate the interposer handling, especially if the interposer is thin. In some embodiments, an interposer or a die ( 124.1 ) has vias in the top surface. Protruding contact pads ( 340.1, 340.2 ) of another die ( 124.1, 124.2 ) are inserted into these vias to provide a strong connection.
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申请公布号 |
US2005136634(A1) |
申请公布日期 |
2005.06.23 |
申请号 |
US20030739788 |
申请日期 |
2003.12.17 |
申请人 |
SAVASTIOUK SERGEY;HALAHAN PATRICK B.;KAO SAM |
发明人 |
SAVASTIOUK SERGEY;HALAHAN PATRICK B.;KAO SAM |
分类号 |
H01L23/14;H01L23/48;H01L23/498;H01L23/538;H01L25/065;(IPC1-7):H01L21/44;H01L23/52;H01L29/40 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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