| 发明名称 |
Thermal interface material bonding |
| 摘要 |
A system may include placement of a first surface of a solder preform on a first surface of a heat dissipator, and rolling of a roller across a second surface of the solder preform. In some embodiments, the system further includes pressing the solder preform and the heat dissipator against each other.
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| 申请公布号 |
US2005133934(A1) |
申请公布日期 |
2005.06.23 |
| 申请号 |
US20030744583 |
申请日期 |
2003.12.23 |
| 申请人 |
MELLODY JAMES P.;HOULE SABINA J.;DEPPISCH CARL L.;HANSEN JONI G.;BURGESS MARVIN J.;DEBLIECK ROBERT C. |
发明人 |
MELLODY JAMES P.;HOULE SABINA J.;DEPPISCH CARL L.;HANSEN JONI G.;BURGESS MARVIN J.;DEBLIECK ROBERT C. |
| 分类号 |
B23K1/00;H01L21/44;H01L21/48;H01L23/48;(IPC1-7):H01L21/44 |
主分类号 |
B23K1/00 |
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