New photoresists are provided that can be applied and imaged with reduced undesired outgassing and/or as thick coating layers. Preferred resists of the invention are chemically-amplified positive-acting resists that contain photoactive and resin components.
申请公布号
WO2004092831(A3)
申请公布日期
2005.06.23
申请号
WO2004US11025
申请日期
2004.04.09
申请人
ROHM AND HAAS, ELECTRONIC MATERIALS, L.L.C.;CAMERON, JAMES, F.;TREFONAS, PETER;BARCLAY, GEORGE, C.
发明人
CAMERON, JAMES, F.;TREFONAS, PETER;BARCLAY, GEORGE, C.
