| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring structure which can finely wire even if the body of the wiring structure contains a copper as a main component, which has a low specific resistance, which is hard to diffuse the copper in the periphery, and which has a high adhesion strength to a substrate. SOLUTION: The wiring structure includes a seed layer 30 formed of a metal material obtained by mixing a metal for forming a metal oxide with the copper as the main component and provided on the surface 70a to be treated of the substrate 70, a barrier layer 32 formed by oxidizing the metal for forming the metal oxide contained in the metal material and provided between the substrate 70 and the seed layer 30, and a copper wiring layer 33 provided on the sheet layer 30. COPYRIGHT: (C)2005,JPO&NCIPI |
