| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a die by which a thin uniform bonding material layer bonded to a pickup tape can be formed on the anti-circuit surface of a diced thin large-sized semiconductor die at the time of picking up the die. SOLUTION: When the anti-circuit surface of a wafer is polished with a grinder 8 after many grooves are formed in the wafer from the circuit surface of the wafer, a plurality of semiconductor dies 3 are obtained. Then a liquid raw bonding material 4c is sprayed on the anti-circuit surfaces 3c of the semiconductor dies 3 by means of a spraying means 16. When the liquid raw bonding material 4c is modified by means of a modifying means 17, bonding materials 4 are formed on the semiconductor dies 3. When surface protective tapes 7 are peeled off from the semiconductor dies 3, a plurality of desired semiconductor dies 3 is obtained. When the surface protective tapes 7 are peeled off from the semiconductor dies 3, the bonding materials 4 formed on the surface protective tapes 7 exposed from the spaces among the semiconductor dies 3 are removed together with the tapes 7. COPYRIGHT: (C)2005,JPO&NCIPI |
