摘要 |
PROBLEM TO BE SOLVED: To provide a honeycomb sandwich panel capable of reducing a space required for wiring a power source line and a signal line connected with an electronic apparatus and mounting the electronic apparatus on the panel with a high density with respect to a heat-pipe embedded honeycomb sandwich panel that is used as a panel for mounting the apparatus of a spacecraft and a satellite and required for demands as a structural material and the heat dissipating plate of the mounted electronic apparatus. SOLUTION: In a heat-pipe embedded honeycomb sandwich panel formed of a honeycomb sandwich panel and a heat pipe 3 embedded in this honeycomb sandwich panel, a power source line 6 and a signal line 7 for an electronic apparatus 5 attached to one surface or both surfaces of the panel are provided in a printed circuit board embedded in the honeycomb sandwich panel. COPYRIGHT: (C)2005,JPO&NCIPI |