发明名称 HEAT-PIPE EMBEDDED HONEYCOMB SANDWICH PANEL
摘要 PROBLEM TO BE SOLVED: To provide a honeycomb sandwich panel capable of reducing a space required for wiring a power source line and a signal line connected with an electronic apparatus and mounting the electronic apparatus on the panel with a high density with respect to a heat-pipe embedded honeycomb sandwich panel that is used as a panel for mounting the apparatus of a spacecraft and a satellite and required for demands as a structural material and the heat dissipating plate of the mounted electronic apparatus. SOLUTION: In a heat-pipe embedded honeycomb sandwich panel formed of a honeycomb sandwich panel and a heat pipe 3 embedded in this honeycomb sandwich panel, a power source line 6 and a signal line 7 for an electronic apparatus 5 attached to one surface or both surfaces of the panel are provided in a printed circuit board embedded in the honeycomb sandwich panel. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005167233(A) 申请公布日期 2005.06.23
申请号 JP20040334589 申请日期 2004.11.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAO AKIRA
分类号 F28D15/02;H01L23/427;H05K7/20;(IPC1-7):H05K7/20 主分类号 F28D15/02
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