| 摘要 |
PROBLEM TO BE SOLVED: To provide a ball mounting apparatus that can mount minute solder balls on a large-sized substrate at an industrial level by improving a substrate placing device. SOLUTION: The ball mounting apparatus is composed of the substrate placing device for placing a substrate on which the solder balls are mounted, a ball dropping-down device which drops down solder balls supplied onto a mask closely adhered to the substrate into the opening of the mask, and a ball pressing device having a ball pressing head which presses the solder balls dropped down into the opening against the substrate. The substrate placing device is provided with a suction force generating device which can be moved upward and downward at need. Therefore, in a step of closely adhering the mask to the substrate, the mask is sucked to the substrate with a strong force by bringing the suction force generating device nearer to the mask. In a step of separating the mask and substrate from each other, the mask and the substrate are separated from each other in a state where the suction force is hardly applied to the mask by separating the suction force generating device from the mask. COPYRIGHT: (C)2005,JPO&NCIPI
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