METHOD AND DEVICE FOR TREATING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for treating substrate by which the surfaces of various types of substrates is treated safely to high quality by improving efficiency of drying treatment and reducing a use amount of a dangerous drying fluid at the time of treating the substrates. SOLUTION: In the method of treating substrate, a surface of a substrate W to be treated is treated by spraying a treating fluid upon the substrate W while the substrate W is rotated in a nearly horizontally held. At the time of drying the substrate, a flat injection nozzle 50 composed of a flat tunnelled duct 51 having a closed outlet and an opened bottom surface and an exhaust sucking duct 60 surrounding part of the outer periphery of the duct 51 are set toward the portion of the substrate W from the central part to the outer peripheral edge in a state where the nozzle 50 and duct 60 are set in parallel with each other at a prescribed interval from the substrate W. Then the drying fluid supplied from the entrance of the tunnel-like duct 51 is sprayed upon the substrate W by adjusting the pressure P1of the fluid in the duct 51 produced when the fluid is interrupted by the closed end 50 of the outlet of the duct 51 and stays temporarily in the duct 51 to P1>P2(wherein, P1is the pressure inside the tunnelled duct 51, and P2is the suction force of the exhaust sucking duct 60). COPYRIGHT: (C)2005,JPO&NCIPI